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High Thermal Conductivity Silicone Pad Insulating And Heat Resistant CPU And Power Devices Silicone Heat-Conducting Pad

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High Thermal Conductivity Silicone Pad Insulating And Heat Resistant CPU And Power Devices Silicone Heat-Conducting Pad

Name: High Thermal Conductivity Silicone Pad Insulating And Heat Resistant CPU And Power Devices Silicone HeatConducting Pad
Brand: Ziitek
Price: 0.1 USD

China High Thermal Conductivity Silicone Pad Insulating And Heat Resistant CPU And Power Devices Silicone Heat-Conducting Pad wholesale

Brand Name : Ziitek

Model Number : TIF100C 8045-11

Certification : RoHS and UL recognized

Place of Origin : China

MOQ : 1000pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 1000000 pcs/month

Delivery Time : 3-5 work days

Packaging Details : 24*13*12cm cartons

Products name : High Thermal Conductivity Silicone Pad Insulating And Heat Resistant CPU And Power Devices Silicone Heat-Conducting Pad

Color : Gray

Flam rating : 94V0

Thermal Conductivity : 8.0 W/mK

Thinkness range : 0.012"(0.30mm)~0.200"(5.00mm)

Keywords : Silicone Thermal Pad

Hardness : 45 Shore 00

Application : CPU And Power Devices

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High Thermal Conductivity Silicone Pad Insulating And Heat Resistant CPU And Power Devices Silicone Heat-Conducting Pad

Company Profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

TS-TIF^®100C 8045-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases.lts flexibility and elasticity make it ideal for covering highly uneven surfaces.With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs to liquid cooling plates or metal heat dissipation structures, thereby improving the cooling efficiency of high-power electronic components and extending the lifespan of the equipment.

Features:

>Excellent thermal conductivity 8.0W/mK

>Self-adhesive without the need for additional surface adhesive
>Highly compressible, soft, and elastic

>Available in various thicknesses
>Good chemical stability

Applications:

>CPU and GPU processors and other chipsets
>High-performance computing (HPC)

>Industrial equipment
>Network communication devices

>New energy vehicles

Typical Properties of TS-TIF^®100C 8045-11 Series
Color	Gray	Visual
Construction & Compostion	Ceramic filled silicone elastomer	******
Specific Gravity	3.4g/cc	ASTM D297
thickness	0.012"(0.30mm)~0.200"(5.00mm)	ASTM D374
Hardness (thickness＜1.0mm)	45 (Shore 00)	ASTM 2240
Continuos Use Temp	-45 to 200℃	******
Dielectric Breakdown Voltage	≥5500 VAC	ASTM D149
Dielectric Constant	7.2MHz	ASTM D150
Volume Resistivity	≥1.0X10¹²Ohm-meter	ASTM D257
Fire rating	94 V0	equivalent UL
Thermal conductivity	8.0W/m-K	ASTM D5470

Standard Thicknesses:

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

Product Specification
Product Thicknesses: 0.012"(0.30mm)-0.200"(5.00mm)

Product Sizes:8" x 16"(203mm x406mm)
Custom die-cut shapes and thicknesses are available.Please contact us for details.
Store in a cool, dry place, away from fire and sunlight.

High Thermal Conductivity Silicone Pad Insulating And Heat Resistant CPU And Power Devices Silicone Heat-Conducting Pad

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated.

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

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